Monday, April 14, 2008

[ News, Science / Tech, April 2 2008] Hynix inks tie-up deal with U.S. firm

Hynix Semiconductor Inc., the world’s No. 2 computer memory chip maker, said Wednesday (Apr. 2) it has signed a deal with U.S. chipmaker Grandis Inc. to cooperate in developing next-generation random access memories (RAMs).

The deal signed Monday calls for the joint development of STT-RAMs, or spin-transfer torque-RAMs, by integrating Grandis’s technology into Hynix’s memory products, the Korean company said.

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