[Korea.net News, Science / Tech, September 5 2007] Hynix Semiconductor develops improved multi-chip package for portable devices

Hynix Semiconductor said Wednesday (Sept. 5) that it has developed a multi-chip package (MCP), a memory product made of 24 flash memories, setting a benchmark for small-sized but high-capacity chip products.

Hynix said that the memory chip can provide up to 48 gigabytes of storage capacity, allowing users to carry 25 movie clips or 12,000 digital music files in a coin-sized MCP.