Wednesday, May 21, 2008

[ News, Economy / Industry, May 6 2007] Samsung, Intel, TSMC agree on joint chip-making standard

Samsung Electronics Co. said Tuesday (May 6) it has forged an agreement with Intel Corp. and Taiwan Semiconductor Manufacturing Co. to unify their chip-making standards aimed at larger production.

The agreement calls for cooperation in introducing 450-millimeter wafer production facilities starting in 2012, in order to move away from the current production of 300-millimeter wafers, Samsung said in a statement.

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